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HSMF-C118
TriColor ChipLED
Data Sheet
Description
The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with IR soldering and binned by both color and intensity.
Features
* Common anode * Small 3.2 x 2.7 x 1.1 mm package * Diffused optics * Red/Green/Blue color combination * Available in 8 mm tape on 7 inch (178 mm) diameter reels * High brightness using AlInGaP and InGaN die technology * Compatible with reflow soldering
Applications
* Backlighting * Status indicator * Front panel indicator * Office automation, home appliances, industrial equipment
CAUTION: HSMF-C118 is Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
LED DIE
3
2 1.5 (0.059) 2.7 (0.106)
4
1 COMMON ANODE
3.2 (0.126 )
0.6 (0.024) DIFFUSED EPOXY PC BOARD
2.0 (0.079)
1
1.1 (0.043) 2 RED 3 GREEN POLARITY 0.7 (0.028) 4 BLUE
0.5 (0.020)
ANODE MARK
0.4 (0.016)
SOLDERING TERMINAL
1.1 (0.043)
4 - 0.05 (0.002)
NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE 0.1 mm UNLESS OTHERWISE NOTED.
2
Absolute Maximum Ratings at TA = 25C
Parameter DC Forward Current[1, 3, 4] Power Dissipation[1] DC Forward Current[2] Power Dissipation[2] Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature AlInGaP Red 20 48 15 36 5 95 InGaN Green InGaN Blue 20 20 78 78 15 15 59 59 5 5 95 95 -30 to +85 -40 to +85 See reflow soldering profile (Figures 6 & 7) Units mA mW mA mW V C C C
Notes: 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure 4. 4. Drive currents above 5 mA are recommended for best long term performance.
Electrical Characteristics at TA = 25C
Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 2.4 3.5 3.9 3.5 3.9 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. 17 110 110 Thermal Resistance RJ-PIN (C/W) Typ. 400 450 450
Color AlInGaP Red InGaN Green InGaN Blue
Optical Characteristics at TA = 25C
Luminous Intensity Iv (mcd) @ IF = 20 mA[1] Min. Typ. 28.5 90 45.0 120 11.2 40 Peak Wavelength peak (nm) Typ. 637 523 468 Color, Dominant Wavelength d[2] (nm) Typ. 626 525 470 Viewing Angle 2 1/2 Degrees[3] Typ. 135 130 125 Luminous Efficacy v (lm/W) Typ. 155 490 80
Color AlInGaP Red InGaN Green InGaN Blue
Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3
Intensity (Iv) Bin Limits[1]
Bin ID L M N P Q R S Intensity (mcd) Min. Max. 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00
CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consis-tency over time, or uniformity in luminous intensity when more than 1 LED is lit. 3. Please refer to Application Brief AB D-007 for additional details/explanation on driving the part in parallel circuit.
Tolerance: 15%.
Color Bin Limits [1] Blue Color Bins
Bin ID A B C D Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0
Tolerance: 1 nm
Red Color Bins
Bin ID - Dom. Wavelength (nm) Min. Max. 620.0 635.0
Tolerance: 1 nm
Green Color Bins
Bin ID A B C D Dom. Wavelength (nm) Min. Max. 515.0 520.0 520.0 525.0 525.0 530.0 530.0 535.0
Tolerance: 1 nm
Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on currently available bins.
100 90 80 RELATIVE INTENSITY 70 60 50 40 30 20 10 0 400 450 500 550 600 650 700
InGaN BLUE InGaN GREEN
100 IF - FORWARD CURRENT - mA
1.4 1.2 LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
AS RED
10
RED
1.0 0.8 0.6 0.4 0.2 RED GREEN, BLUE
1
GREEN & BLUE
0.1
0
1.5
2.0
2.5
3.0
3.5
4.0
0
5
10
15
20
25
30
WAVELENGTH - nm
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward current.
IF MAX. - MAXIMUM FORWARD CURRENT - mA
25 20 AS RED 15 GREEN, BLUE 10 5 0
1.0 0.9 RELATIVE INTENSITY - % 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1
0 10 20 30 40 50 60 70 80 90
RED BLUE GREEN 0 ANGLE 10 20 30 40 50 60 70 80 90
TA - AMBIENT TEMPERATURE - C
0 -90 -80 -70 -60 -50 -40 -30 -20 -10
Figure 4. Maximum forward current vs. ambient temperature (1 chip lit up).
Figure 5. Relative intensity vs. angle.
10 - 30 SEC.
10 SEC. MAX.
TEMPERATURE
TEMPERATURE
230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC. MAX.
217 C 200 C 150 C
255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX.
Figure 6. Recommended Pb-Free reflow soldering profile.
(Acc. to J-STD-020C)
Figure 7. Recommended Pb-Free reflow soldering profile.
1.0 (0.039)
0.4 (0.016)
1.0 (0.039) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059)
Figure 8. Recommended soldering pattern.
USER FEED DIRECTION
xxxxx xxxxx xxx xxxxxxx xxxxx
PRINTED LABEL
CATHODE SIDE
Figure 9. Reeling orientation.
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 13.1 0.5 (O 0.516 0.020)
3.0 0.5 (0.118 0.020)
O 20.20 MIN. (O 0.795 MIN.)
178.40 1.00 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
Figure 10. Reel dimensions.
4.00 (0.157) 1.50 (0.059)
CATHODE
DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002)
DIM. A (SEE TABLE 1)
8.00 0.30 (0.315 0.012)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157)
USER FEED DIRECTION COVER TAPE
CARRIER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C118 DIM. A 0.10 ( 0.004) 3.52 (0.139) DIM. B 0.10 ( 0.004) 3.02 (0.119) DIM. C 0.10 ( 0.004) 1.40 (0.055)
Figure 11. Tape dimensions.
END
START
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Figure 12. Tape leader and trailer dimensions.
Reflow Soldering:
For more information on reflow soldering, refer to Application Note AN-100, Surface Mounting SMT LED Indicator Components.
Storage Condition: to 30C @ 0%RH max.
Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 C. 2. Device expose to factory conditions <30C/0%RH more than 72 hours. Recommended baking condition: 0C for 20 hours.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-4811EN AV02-0610EN - July 25, 2006

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